Experimental investigations and numerical simulations of diffusion induced phase separation and coarsening in binary solders.
Modeling of damage and fatigue in solders, numerical simulations of segregation in binary alloys:
Identification of material parameters:
Inverse analysis of tensile tests, hardness measurements, nanoindentations and shock trials.
Fail by damage, fracture and/or folding
FE-simulation of failure and breakup of plate structures under sudden load.